Thin films and polymers consulting for wafer bumping and wafer level packaging...

Optomag provides technical consulting services and help you find engineering solutions for your thin-film and semiconductor packaging polymer processes.

We provide engineering consulting services backed by a strong technical knowledge of advanced semiconductor packaging:

DESIGN AND MASK LAYOUT FOR PACKAGING

• We have the software and computer equipment to generate your bumping and redistribution layers layouts:
• Create your own evaluation wafers to compare bumping capabilities and wafer level reliability of vendors
  
• Develop your own in-house process masks
  
• Create your own proprietary wafer masks for the foundry of your choice
  

NEW POLYMER EVALUATION

• We will work with you to:
• Evaluate new materials for your packaging solutions
  
• Monitor vendors or evaluate potential vendors
  
• Introduce new in-house processes or improvements over existing processes
  
• Develop new wafer level and 3-D packaging techniques
  

THIN FILM MATERIALS

• We will help you select and evaluate:
• Polymers or inorganic dielectrics
  
• Metallization schemes for RDL, UBM and 3-D interconnect
  
• Bumping methods for your lead-free solders or specialized bumping requirements
  

THIN FILM PROCESSES

• We will assist you with:
• Your sputtering process development, equipment selection or acquisition
  
• Your plasma and wet etching process development for polymers, metal stacks and silicon
  
• Your photolithography processes and equipment
  
  
  
  

  Only search Wafer-Bumping site

Last updated Mar. 12, 2007

Tel: 1-602-334-4125 Nous parlons français