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Recent packaging papers:

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  • " Applications of FTIR to Advanced Packaging final" John J. H. Reche

    This paper was presented at a 11th meeting of the Eleventh Meeting of the Symposium on Polymers for Microelectronics at Winterthur held in Wilmington Delaware May 5,6 and 7, 2004.

  • " Wafer level packaging having bump-on-polymer structure" John J. H. Reche and Deok-Hoon Kim

    This paper is the "Introductory Invited Paper" in the June 2003 issue of Microelectronics Reliability. (Vol. 43, Issue 6 , June 2003, Pages 879-894). The paper describes some details of the new technology introduced by Kulicke & Soffa's (K&S) Flip Chip Division (formerly Flip Chip Technologies) and marketed under the name of Spheron (TM). This WLP technology uses a polybenzoxazole (PBO). The selected polymer demonstrates not only excellent reliability but also provides exceptional manufacturability. The favorable mechanical toughness, high elongation, and excellent adhesion to organic and inorganic materials provides excellent performance in reliability tests.

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  • "Wafer Thinning & Trough-Silicon Vias - The path to 3-D Wafer-Level Packaging" John J. H. Reche

    This paper was presented at a meeting of the IEEE-CPMT, Silicon Valley Chapter, in Santa Clara CA May 10, 2000.

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