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  • Applications of FTIR to Advanced Packaging final (2.1 Mb)

  • WLP bump-on-polymer structure (780 Kb)

  • Mask design for performace evaluation of polymers (416 Kb)

  • Atmospheric Plasma Etching - CPMT Santa Clara (4.5 Mb)

  • Fabrication of High Density Multichip Modules (677 Kb)

  • Multichip Modules Buzzwords or Bonanza (758 Kb)

  • Fabrication of High Density Multichip Modules - Suss (680 Kb)

  • Nepcon March 1990 Workshop on Fabrication of Thin-Film Multichip Modules (155 Kb)

  • Photolithography for Thin-Film MCMs (690 Kb)

  • Magnetic Thin-Film Head Technology for High Density Disc storage (875 Kb)

  • Measurements of Magnetic Properties of Digital Vertical Recording Media by Optical Means (1 Mb)

  • Wire Bonding of Magn etic Thin-Film Heads for Digital Recording (204 Kb)

  • Method for Multilayer Semiconductor Device Processing (681 Kb)

  • High Performance Substrates for Thin-Film Applications (130 Kb)

  • Plasma assisted oxidation anodization and nitridation of silicon (450 Kb)

  • Polyimides in Hybrid Circuit Processing (290 Kb)

  • Preparation and Properties of Plasma-Anodized Silicon Dioxide Films (466 Kb)

  • The Deformation of Anodic Films during the Plasma Anodization of Al-Si Structures (808 Kb)

  • Dual memory cells by anodization (316 Kb)

  • Registration Technique for Multilayer Thick Film Work (515 Kb)

  • Fabrication of thick direct and indirect thick-film screens (682 Kb)

  • US 2,710,853 Polyimides of Pyromellitic acid (381 Kb)

  • US 3,801,880 Polyimide application in Hitachi semiconductor (968 Kb)