Printed Circuit Boards
PCB for WLP Reliability Tests
At completion of the process optimization phase, the wafers need to be diced and the singulated dies assembled on printed circuit boards to test reliability.
To facilitate the testing phase, we have designed boards matching the footprint of the test dies. The boards have test points distributed in a convenient pattern for easy probing. In order to perform electrically biased reliability tests, the boards are designed to be plugged. The contact pattern matches MIL-spec connectors capable of surviving prolonged exposure to high temperatures. Soldering points are also provided to directly connect a wiring harness to the board. This is useful when biased tests are performed in a high humidity environment.